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CST: 20/05/2019 21:56:40   

Mitsubishi Electric US Semiconductor & Device Division to Exhibit New Products at APEC Conference in Anaheim, CA March 18-20

84 Days ago

New Products & Seminars Will Be Presented

CYPRESS, Calif., Feb. 25, 2019 (GLOBE NEWSWIRE) -- Mitsubishi Electric’s Semiconductor & Device Division (SDD) will exhibit its power semiconductor products and present targeted seminars at the Applied Power Electronics Conference (APEC) in Anaheim, CA, March 18-20, 2019.

Located in booth #139, the full lineup of products will be on display including seventh generation IGBTs, G1 Series IPMs, Version 6 DIPIPMs, SLIMDIPs, DIPIPM+, MISOP, J1-Series Automotive modules, X-Series High Voltage IGBTs and SiC based modules.

The SDD Application Engineering Team will present the following seminars and a paper:

Seminars

Advantages of a 3.3kV SiC MOSFET Module in Traction Applications
Presented by Mark Steiner
Tuesday, March 19, 2019, 8:30 – 11:55 (5th Presentation), Room 210A

LV100 and HV100 New Industry Standard Packages for High Power Applications
Presented by Eric Motto
Tuesday, March 19, 2019, 14:15 – 14:45, Room Theatre 1

New Transfer Molded SMD IPM for Compact Inverters (MISOP)
Presented by Michael Rogers
Wednesday, March 20, 2019, 8:30 – 10:10, Room 210D

Paper

An Experimental Approach to Identify Source and Cause of Radiation Noise Over Inverter System and Bare Power Chips
Presented by Toshiya Tadakuma
Thursday, March 21, 2019, 11:30 – 14:00, Poster Area

About Mitsubishi Electric US, Inc., Semiconductor & Device Division

The Semiconductor & Device Division of Mitsubishi Electric US, Inc. offers a portfolio of semiconductor and electronic devices that contribute to the advancement of information processing, telecommunications and the efficient use of energy. The division’s next-generation optical devices, high-frequency gallium nitride and gallium arsenide devices and silicon RF devices are used in a range of applications such as datacenters, satellite base stations and two-way radios to support today's rapidly evolving telecommunications networks. The division also offers leading-edge TFT-LCD modules and CIS line-scan cameras for industrial image output and image processing. Additionally, the division provides highly efficient power modules for both traditional and renewable energy sources that distribute power effectively and reliably and are used in industrial and automation applications, hybrid and electric vehicles, and home appliances. More information is available at http://us.mitsubishielectric.com/semiconductors/en.

In addition to semiconductor devices, Mitsubishi Electric US group companies’ principal businesses include factory automation equipment, automotive electrical components, elevators and escalators, heating and cooling products, electric utility products, and large-scale video displays for stadiums and arenas. Mitsubishi Electric US group companies have roughly 31 locations throughout North America with approximately 4,000 employees.

Media Contact:
Adam Falcsik
Mitsubishi Electric US, Inc. Semiconductor & Device Division
Adam.Falcsik@meus.mea.com
Phone: (412) 902-2178

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